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Items where Author is "Yang, Xingyu"

Items where Author is "Yang, Xingyu"

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3D imaging damage modelling failure finite element analysis high-speed low-cost machine learning metamodel ML non-destructive evaluation optical coherence tomography power electronic module reliability simulation wire bonds
Number of items: 15.

3D imaging

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

damage modelling

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

failure

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

finite element analysis

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

high-speed

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

low-cost

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

machine learning

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

metamodel

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

ML

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

non-destructive evaluation

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

optical coherence tomography

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

power electronic module

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

reliability

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

simulation

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

wire bonds

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

This list was generated on Sun Dec 22 13:56:15 2024 UTC.