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Items where Author is "Yang, Gi-Chul"

Items where Author is "Yang, Gi-Chul"

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Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:

This list was generated on Tue Aug 4 12:14:50 2020 UTC.