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Items where Author is "Yang, Dan"

Items where Author is "Yang, Dan"

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Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:

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