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Items where Author is "Xu, Sha"

Items where Author is "Xu, Sha"

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Number of items: 5.

Article

Xu, Sha, He, Jie, Morrison, Alastair M. ORCID logoORCID: https://orcid.org/0000-0002-0754-1083, Su, Xiaohua and Zhu, Renhong (2023) The role of bricolage in countering resource constraints and uncertainty in start-up business model innovation. European Journal of Innovation Management. ISSN 1460-1060 (doi:10.1108/EJIM-11-2022-0632)

Xu, Sha, He, Jie, Morrison, Alastair M. ORCID logoORCID: https://orcid.org/0000-0002-0754-1083, De Domenici, Michael and Wang, Yaozhong (2022) Entrepreneurial networks, effectuation and business model innovation of startups: the moderating role of environmental dynamism. Creativity and Innovation Management, 31 (3). pp. 460-478. ISSN 0963-1690 (Print), 1467-8691 (Online) (doi:10.1111/caim.12514)

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, Samjid, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:10.1299/jcst.7.251)

Conference Proceedings

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:10.1109/ECTC.2014.6897466)

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:10.1109/ICEPT.2011.6066874)

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