Items where Author is "Xiao, Fei"
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Conference Proceedings
Hua, Lu, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879
(2018)
A numerical procedure for the optimization of IGBT module packaging.
In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China.
IEEE Xplore (CFP 18553-ART)
(18553).
Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160.
ISBN 978-1538663868; 978-1538663851; 978-1538663875
(doi:10.1109/ICEPT.2018.8480746)