Items where Author is "Wong, C.P."
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Conference Proceedings
Lu, H.
ORCID: 0000-0002-4392-6562
, Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Hung, K.C. and Chan, Y.C.
(2001)
A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly.
In: Proceedings of the 4th International Symposium on Electronic Packaging Technology.
Institute of Electrical and Electronics Engineers, Inc., pp. 338-343.
ISBN 0780398114