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Items where Author is "Warner, Matt"

Items where Author is "Warner, Matt"

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ceramic packaging CFD circuit reliability computational fluid dynamics creep design for manufacture ductility electromagnetic compatibility electronic design automation fatigue mesh generation modules plastic deformation resistors soldering solders stress analysis surface mount technology thermal management (packaging) thermal stresses viscoplasticity
Number of items: 24.

ceramic packaging

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

CFD

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

circuit reliability

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

computational fluid dynamics

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

creep

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

design for manufacture

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

ductility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

electromagnetic compatibility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

electronic design automation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

fatigue

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

mesh generation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

modules

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

plastic deformation

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

resistors

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

soldering

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

solders

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

stress analysis

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

surface mount technology

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

thermal management (packaging)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

thermal stresses

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

viscoplasticity

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

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