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Items where Author is "Vaidyanathan, K."

Items where Author is "Vaidyanathan, K."

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ball grid array (BGA) ball shear test bond strength Finite Element Analysis(FEA) fracture propogation path interfacial reaction phenomena intermetallic compound (IMC) numerical modelling packaging design SiP solder interface strength solder joints
Number of items: 12.

ball grid array (BGA)

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

ball shear test

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

bond strength

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Finite Element Analysis(FEA)

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

fracture propogation path

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

interfacial reaction phenomena

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

intermetallic compound (IMC)

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

numerical modelling

Strusevitch, Nadia, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

packaging design

Strusevitch, Nadia, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

SiP

Strusevitch, Nadia, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

solder interface strength

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

solder joints

Strusevitch, Nadia, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

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