Items where Author is "Uddin, Jasim Md."
3D printing
Economidou, Sophia N., Pissinato Pere, Cristiane Patricia, Reid, Andrew, Uddin, Jasim Md., Windmill, James F.C., Lamprou, Dimitrios A. and Douroumis, Dennis ORCID: https://orcid.org/0000-0002-3782-0091 (2019) 3D printed microneedle patches using stereolithography (SLA) for intradermal insulin delivery. Materials Science and Engineering C, 102. pp. 743-755. ISSN 0928-4931 (doi:10.1016/j.msec.2019.04.063)
Inkjet coating
Economidou, Sophia N., Pissinato Pere, Cristiane Patricia, Reid, Andrew, Uddin, Jasim Md., Windmill, James F.C., Lamprou, Dimitrios A. and Douroumis, Dennis ORCID: https://orcid.org/0000-0002-3782-0091 (2019) 3D printed microneedle patches using stereolithography (SLA) for intradermal insulin delivery. Materials Science and Engineering C, 102. pp. 743-755. ISSN 0928-4931 (doi:10.1016/j.msec.2019.04.063)
Insulin
Economidou, Sophia N., Pissinato Pere, Cristiane Patricia, Reid, Andrew, Uddin, Jasim Md., Windmill, James F.C., Lamprou, Dimitrios A. and Douroumis, Dennis ORCID: https://orcid.org/0000-0002-3782-0091 (2019) 3D printed microneedle patches using stereolithography (SLA) for intradermal insulin delivery. Materials Science and Engineering C, 102. pp. 743-755. ISSN 0928-4931 (doi:10.1016/j.msec.2019.04.063)
Microneedles
Economidou, Sophia N., Pissinato Pere, Cristiane Patricia, Reid, Andrew, Uddin, Jasim Md., Windmill, James F.C., Lamprou, Dimitrios A. and Douroumis, Dennis ORCID: https://orcid.org/0000-0002-3782-0091 (2019) 3D printed microneedle patches using stereolithography (SLA) for intradermal insulin delivery. Materials Science and Engineering C, 102. pp. 743-755. ISSN 0928-4931 (doi:10.1016/j.msec.2019.04.063)
μCT
Economidou, Sophia N., Pissinato Pere, Cristiane Patricia, Reid, Andrew, Uddin, Jasim Md., Windmill, James F.C., Lamprou, Dimitrios A. and Douroumis, Dennis ORCID: https://orcid.org/0000-0002-3782-0091 (2019) 3D printed microneedle patches using stereolithography (SLA) for intradermal insulin delivery. Materials Science and Engineering C, 102. pp. 743-755. ISSN 0928-4931 (doi:10.1016/j.msec.2019.04.063)