alloying additions

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

BGA

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

copper alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

dissolving

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

electromigration

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

eutectic alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

heat dissipation

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

integrated circuit metallisation

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

Joule heating

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

nucleation

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

silver alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

solder joint

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

soldering

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

tin alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)