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Items where Author is "Toh, Kok Chuan"

Items where Author is "Toh, Kok Chuan"

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adhesive bonding adhesives CFD chip scale packaging computational fluid dynamics conducting materials cooling design of experiments electronic engineering computing fine-pitch technology finite element analysis finite volume methods flip-chip devices flow simulation forced convection integrated circuit interconnections integrated optoelectronics LED displays microassembling natural convection optical backplanes optical couplers organic light emitting diodes printing semiconductor device packaging semiconductor device reliability solders surface emitting lasers surface mount technology temperature distribution thermal expansion thermal management (packaging) turbulence
Number of items: 37.

adhesive bonding

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

adhesives

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

CFD

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

chip scale packaging

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

computational fluid dynamics

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

conducting materials

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

cooling

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

design of experiments

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

electronic engineering computing

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

fine-pitch technology

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

finite element analysis

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

finite volume methods

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

flip-chip devices

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

flow simulation

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

forced convection

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

integrated circuit interconnections

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

integrated optoelectronics

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

LED displays

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

microassembling

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

natural convection

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

optical backplanes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

optical couplers

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

organic light emitting diodes

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

printing

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

semiconductor device packaging

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

semiconductor device reliability

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

solders

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

surface emitting lasers

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

surface mount technology

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

temperature distribution

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

thermal expansion

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

thermal management (packaging)

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

turbulence

Dhinsa, K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

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