Items where Author is "Tee, T.Y."
Book Section
Alam, M. O., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y.
(2007)
Shear strength analysis of ball grid array (BGA) solder interfaces.
In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.)
2007 9th Electronics Packaging Technology Conference.
Electronics Packaging Technology Conference Proceedings
.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773.
ISBN 9781424413249
(doi:11.1109/EPTC.2007.4469797)
Strusevitch, Nadia, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Liu, D., Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V.
(2006)
Modelling the behavior of solder joints for wafer level SiP.
In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.)
2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore.
IEEE, Picsataway, N.J., pp. 127-132.
ISBN 1424406641; 142440665X
(doi:10.1109/EPTC.2006.342703)