acoustic streaming

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-013-0039-9)

Strusevich, Nadezhda (2013) Numerical modelling of electrodeposition process for printed circuit boards manufacturing. PhD thesis, University of Greenwich.

continuum modeling

Christakis, Nicholas, Chapelle, Pierre, Strusevich, Nadezhda, Bridle, Ian, Baxter, John, Patel, Mayur K., Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S. A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)

core flow

Christakis, Nicholas, Chapelle, Pierre, Strusevich, Nadezhda, Bridle, Ian, Baxter, John, Patel, Mayur K., Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S. A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)

current density

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

electrodeposition

Strusevich, Nadezhda (2013) Numerical modelling of electrodeposition process for printed circuit boards manufacturing. PhD thesis, University of Greenwich.

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

electrolytes

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

electronics manufacturing

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-013-0039-9)

electroplating

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-013-0039-9)

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

enhanced ion transport

Strusevich, Nadezhda (2013) Numerical modelling of electrodeposition process for printed circuit boards manufacturing. PhD thesis, University of Greenwich.

granular material

Christakis, Nicholas, Chapelle, Pierre, Strusevich, Nadezhda, Bridle, Ian, Baxter, John, Patel, Mayur K., Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S. A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)

high aspect ratio microvia

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-013-0039-9)

megasonic agitation

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-013-0039-9)

Strusevich, Nadezhda (2013) Numerical modelling of electrodeposition process for printed circuit boards manufacturing. PhD thesis, University of Greenwich.

micro-physical parametrizations

Christakis, Nicholas, Chapelle, Pierre, Strusevich, Nadezhda, Bridle, Ian, Baxter, John, Patel, Mayur K., Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S. A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)

microelectronics

Strusevich, Nadezhda (2013) Numerical modelling of electrodeposition process for printed circuit boards manufacturing. PhD thesis, University of Greenwich.

microvias

Strusevich, Nadezhda (2013) Numerical modelling of electrodeposition process for printed circuit boards manufacturing. PhD thesis, University of Greenwich.

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

numerical modelling

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-013-0039-9)

printed circuits

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

segregation

Christakis, Nicholas, Chapelle, Pierre, Strusevich, Nadezhda, Bridle, Ian, Baxter, John, Patel, Mayur K., Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S. A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)

vias

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)