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Items where Author is "Stewart†, Paul"

Items where Author is "Stewart†, Paul"

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compliant PCB edgebond lifetime modelling micro-BGA physics-of-failure SnPbAgCu quaternary solder alloy solder joint reliability underfill
Number of items: 8.

compliant PCB

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

edgebond

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

lifetime modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

micro-BGA

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

physics-of-failure

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

SnPbAgCu quaternary solder alloy

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

solder joint reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

underfill

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

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