Skip navigation

Items where Author is "Sherriff, Mark"

Items where Author is "Sherriff, Mark"

[up] Up a level
Group by: Item Type | Uncontrolled Keywords | No Grouping
Finite Element Analysis (FEA) Model Order Reduction (MOR) Parametric Model Order Reduction (pMOR) Power Electronics Module (PEM) thermal analysis
Number of items: 5.

Finite Element Analysis (FEA)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Sherriff, Mark, Agyakwa, Pearl, Paul, Evans and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2025) Thermal analysis of power electronic modules with parametric Model Order Reduction. In: 25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-1739500511 (doi:10.23919/EMPC63132.2025.11222433)

Model Order Reduction (MOR)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Sherriff, Mark, Agyakwa, Pearl, Paul, Evans and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2025) Thermal analysis of power electronic modules with parametric Model Order Reduction. In: 25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-1739500511 (doi:10.23919/EMPC63132.2025.11222433)

Parametric Model Order Reduction (pMOR)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Sherriff, Mark, Agyakwa, Pearl, Paul, Evans and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2025) Thermal analysis of power electronic modules with parametric Model Order Reduction. In: 25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-1739500511 (doi:10.23919/EMPC63132.2025.11222433)

Power Electronics Module (PEM)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Sherriff, Mark, Agyakwa, Pearl, Paul, Evans and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2025) Thermal analysis of power electronic modules with parametric Model Order Reduction. In: 25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-1739500511 (doi:10.23919/EMPC63132.2025.11222433)

thermal analysis

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Sherriff, Mark, Agyakwa, Pearl, Paul, Evans and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2025) Thermal analysis of power electronic modules with parametric Model Order Reduction. In: 25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-1739500511 (doi:10.23919/EMPC63132.2025.11222433)

This list was generated on Thu Nov 20 04:09:48 2025 UTC.