Items where Author is "Seman, Anton"
![[up]](/style/images/multi_up.png)
Up a levelattenuation
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)
cement-based materials
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)
flip-chip assembly applications
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684527)
microstructure
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)
printing performance
Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416423)
rheological behaviour
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684527)
rheological behaviours
Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416423)
rheology
Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)
rheology measurement
Seman, Anton (2010) On-line non-destructive ultrasonic rheology measurement of solder pastes. PhD thesis, University of Greenwich.
solder joints
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
solder particles
Seman, Anton (2010) On-line non-destructive ultrasonic rheology measurement of solder pastes. PhD thesis, University of Greenwich.
solder paste
Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)
solder pastes
Seman, Anton (2010) On-line non-destructive ultrasonic rheology measurement of solder pastes. PhD thesis, University of Greenwich.
Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416423)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684527)
stress
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)
stretched exponential model
Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)
thixotropy
Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)
ultrasonic testing
Seman, Anton (2010) On-line non-destructive ultrasonic rheology measurement of solder pastes. PhD thesis, University of Greenwich.
viscosity
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)