Items where Author is "Salam, B."

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electronics packaging inter-metallic compounds particles rheological characterization simulation solder joints solder paste

Number of items: 7.

electronics packaging

Salam, B. and Ekere, Ndy (2006) A study of inter-metallic compounds (IMC) formation and growth in ultra-fine pitch Sn-Ag-Cu lead-free solder joints. ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 988-994. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280131)

inter-metallic compounds

Salam, B. and Ekere, Ndy (2006) A study of inter-metallic compounds (IMC) formation and growth in ultra-fine pitch Sn-Ag-Cu lead-free solder joints. ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 988-994. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280131)

particles

Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:https://doi.org/10.1023/A:1023929119055)

rheological characterization

Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:https://doi.org/10.1023/A:1023929119055)

simulation

Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:https://doi.org/10.1023/A:1023929119055)

solder joints

Salam, B. and Ekere, Ndy (2006) A study of inter-metallic compounds (IMC) formation and growth in ultra-fine pitch Sn-Ag-Cu lead-free solder joints. ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 988-994. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280131)

solder paste

Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:https://doi.org/10.1023/A:1023929119055)

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