Items where Author is "Richardson, A."
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Strusevitch, Nadia, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Liu, D., Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V.
(2006)
Modelling the behavior of solder joints for wafer level SiP.
In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.)
2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore.
IEEE, Picsataway, N.J., pp. 127-132.
ISBN 1424406641; 142440665X
(doi:https://doi.org/10.1109/EPTC.2006.342703)