Items where Author is "Pecht, Michael"
bonding
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
ceramics
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
condition monitoring
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
copper
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
degradation
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
failure analysis
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
failure mechanisms
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
fatigue
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
fusion approach
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
insulated gate bipolar transistors
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
multichip modules
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
parameters
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)
wire
Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael
(2009)
A fusion approach to IGBT power module prognostics.
In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199.
ISBN 9781424441600
(doi:10.1109/ESIME.2009.4938491)