Conference Proceedings

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Sherriff, Mark, Agyakwa, Pearl, Paul, Evans and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2025) Thermal analysis of power electronic modules with parametric Model Order Reduction. In: 25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-1739500511 (doi:10.23919/EMPC63132.2025.11222433)