Items where Author is "Parry, John"

Group by: Item Type | Uncontrolled Keywords | No Grouping

Number of items: 36.

adolescence

Crowley, Colm, Hallam, Susan, Harré, Rom and Lunt, Ingrid (2010) Peer support for young people with same-sex attraction. In: Rix, Jonathan, Nind, Melanie, Sheehy, Kieron, Simmons, Katy, Parry, John and Kumrai, Rajni, (eds.) Equality, participation and inclusion 2: Diverse contexts. Routledge, Abingdon, pp. 183-199. ISBN 9780415584241

adolescent

Crowley, Colm, Hallam, Susan, Harré, Rom and Lunt, Ingrid (2010) Peer support for young people with same-sex attraction. In: Rix, Jonathan, Nind, Melanie, Sheehy, Kieron, Simmons, Katy, Parry, John and Kumrai, Rajni, (eds.) Equality, participation and inclusion 2: Diverse contexts. Routledge, Abingdon, pp. 183-199. ISBN 9780415584241

ceramic packaging

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

CFD

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

circuit reliability

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866175)

computational fluid dynamics

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

creep

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

design for manufacture

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

ductility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

electromagnetic compatibility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866175)

electronic design automation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

fatigue

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

life cycle costing

Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866175)

mesh generation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

modules

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

peer support

Crowley, Colm, Hallam, Susan, Harré, Rom and Lunt, Ingrid (2010) Peer support for young people with same-sex attraction. In: Rix, Jonathan, Nind, Melanie, Sheehy, Kieron, Simmons, Katy, Parry, John and Kumrai, Rajni, (eds.) Equality, participation and inclusion 2: Diverse contexts. Routledge, Abingdon, pp. 183-199. ISBN 9780415584241

plastic deformation

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

printed circuit design

Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866175)

quality control

Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866175)

resistors

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

same-sex

Crowley, Colm, Hallam, Susan, Harré, Rom and Lunt, Ingrid (2010) Peer support for young people with same-sex attraction. In: Rix, Jonathan, Nind, Melanie, Sheehy, Kieron, Simmons, Katy, Parry, John and Kumrai, Rajni, (eds.) Equality, participation and inclusion 2: Diverse contexts. Routledge, Abingdon, pp. 183-199. ISBN 9780415584241

sexual orientation

Crowley, Colm, Hallam, Susan, Harré, Rom and Lunt, Ingrid (2010) Peer support for young people with same-sex attraction. In: Rix, Jonathan, Nind, Melanie, Sheehy, Kieron, Simmons, Katy, Parry, John and Kumrai, Rajni, (eds.) Equality, participation and inclusion 2: Diverse contexts. Routledge, Abingdon, pp. 183-199. ISBN 9780415584241

sexuality

Crowley, Colm, Hallam, Susan, Harré, Rom and Lunt, Ingrid (2010) Peer support for young people with same-sex attraction. In: Rix, Jonathan, Nind, Melanie, Sheehy, Kieron, Simmons, Katy, Parry, John and Kumrai, Rajni, (eds.) Equality, participation and inclusion 2: Diverse contexts. Routledge, Abingdon, pp. 183-199. ISBN 9780415584241

soldering

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

solders

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

stress analysis

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

surface mount technology

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

thermal management (packaging)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

thermal stresses

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

viscoplasticity

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

youth

Crowley, Colm, Hallam, Susan, Harré, Rom and Lunt, Ingrid (2010) Peer support for young people with same-sex attraction. In: Rix, Jonathan, Nind, Melanie, Sheehy, Kieron, Simmons, Katy, Parry, John and Kumrai, Rajni, (eds.) Equality, participation and inclusion 2: Diverse contexts. Routledge, Abingdon, pp. 183-199. ISBN 9780415584241

This list was generated on Mon Nov 25 13:58:05 2024 UTC.