Items where Author is "Othman, N"
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curing encapsulant materials
Adamietz, R., Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)
electronics packaging
Adamietz, R., Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)