Items where Author is "Othman, N"
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curing encapsulant materials
Adamietz, R., Tilford, T. 
ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F.
(2010)
Modular microwave-based system for packaging applications.
In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan.
(Unpublished)
electronics packaging
Adamietz, R., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F.
(2010)
Modular microwave-based system for packaging applications.
In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan.
(Unpublished)