Skip navigation

Items where Author is "Nwanoro, Kenneth"

Items where Author is "Nwanoro, Kenneth"

[up] Up a level
Group by: Item Type | Uncontrolled Keywords | No Grouping
Multi-objective optimization Power cycling Power electronics Reliability Thermal cycling Wire/ribbon bond
Number of items: 6.

Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

Power cycling

Nwanoro, Kenneth, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

Power electronics

Nwanoro, Kenneth, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

Reliability

Nwanoro, Kenneth, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

Thermal cycling

Nwanoro, Kenneth, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

Wire/ribbon bond

Nwanoro, Kenneth, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

This list was generated on Sun Feb 2 16:50:08 2025 UTC.