Items where Author is "Nwanoro, Kenneth"
Multi-objective optimization
Nwanoro, Kenneth, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:10.1016/j.microrel.2018.05.013)
Power cycling
Nwanoro, Kenneth, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:10.1016/j.microrel.2018.05.013)
Power electronics
Nwanoro, Kenneth, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:10.1016/j.microrel.2018.05.013)
Reliability
Nwanoro, Kenneth, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:10.1016/j.microrel.2018.05.013)
Thermal cycling
Nwanoro, Kenneth, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:10.1016/j.microrel.2018.05.013)
Wire/ribbon bond
Nwanoro, Kenneth, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:10.1016/j.microrel.2018.05.013)