Items where Author is "Marooney, Chris"

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CFD circuit reliability computational fluid dynamics creep design for manufacture ductility electromagnetic compatibility electronic design automation fatigue mesh generation soldering stress analysis surface mount technology thermal management (packaging) thermal stresses

Number of items: 15.

CFD

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

circuit reliability

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

computational fluid dynamics

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

creep

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

design for manufacture

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

ductility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

electromagnetic compatibility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

electronic design automation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

fatigue

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

mesh generation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

soldering

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

stress analysis

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

surface mount technology

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

thermal management (packaging)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

thermal stresses

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

This list was generated on Fri Apr 4 04:14:57 2025 UTC.