Items where Author is "Mannan, S.H."
atomic diffusions
Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2011)
Multi-physics computer simulation of the electromigration phenomenon.
In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.
IEEE Computer Society, Piscataway, USA, pp. 448-452.
ISBN 9781457717703 (Print), 9781457717680 (Online)
(doi:10.1109/ICEPT.2011.6066874)
atomic vacancies
Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2011)
Multi-physics computer simulation of the electromigration phenomenon.
In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.
IEEE Computer Society, Piscataway, USA, pp. 448-452.
ISBN 9781457717703 (Print), 9781457717680 (Online)
(doi:10.1109/ICEPT.2011.6066874)
current loadings
Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2011)
Multi-physics computer simulation of the electromigration phenomenon.
In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.
IEEE Computer Society, Piscataway, USA, pp. 448-452.
ISBN 9781457717703 (Print), 9781457717680 (Online)
(doi:10.1109/ICEPT.2011.6066874)
electromigration
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C.
(2013)
Comments on electromigration analysis methods.
In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013).
Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534.
ISBN 9781479904983
(doi:10.1109/ICEPT.2013.6756527)
EM simulations
Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2011)
Multi-physics computer simulation of the electromigration phenomenon.
In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.
IEEE Computer Society, Piscataway, USA, pp. 448-452.
ISBN 9781457717703 (Print), 9781457717680 (Online)
(doi:10.1109/ICEPT.2011.6066874)
finite element method
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C.
(2013)
Comments on electromigration analysis methods.
In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013).
Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534.
ISBN 9781479904983
(doi:10.1109/ICEPT.2013.6756527)
multi-physics
Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2011)
Multi-physics computer simulation of the electromigration phenomenon.
In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.
IEEE Computer Society, Piscataway, USA, pp. 448-452.
ISBN 9781457717703 (Print), 9781457717680 (Online)
(doi:10.1109/ICEPT.2011.6066874)
numerical modeling
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C.
(2013)
Comments on electromigration analysis methods.
In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013).
Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534.
ISBN 9781479904983
(doi:10.1109/ICEPT.2013.6756527)
void formation
Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2011)
Multi-physics computer simulation of the electromigration phenomenon.
In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.
IEEE Computer Society, Piscataway, USA, pp. 448-452.
ISBN 9781457717703 (Print), 9781457717680 (Online)
(doi:10.1109/ICEPT.2011.6066874)
voids evolution
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C.
(2013)
Comments on electromigration analysis methods.
In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013).
Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534.
ISBN 9781479904983
(doi:10.1109/ICEPT.2013.6756527)