isotropic conductive adhesives

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416511)

lead-free

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

rheology

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

solder paste

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

solder pastes

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416511)

stencil printing process

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

thixotropy

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

viscosity

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

wall-slip

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

wall-slip behavior

Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416511)