Conference Proceedings

Lu, H. ORCID: 0000-0002-4392-6562 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 , Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114