Items where Author is "Lui, Y.T."
![[up]](/style/images/multi_up.png)
Up a levelNumber of items: 1.
Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:10.1063/1.3552519)