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Items where Author is "Liu, Johan"

Items where Author is "Liu, Johan"

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computer modelling Cu columns Electronic Packaging flip chip packaging Multi-physics modeling Numerical Optimilation Reliability Response Surface Thermal Management
Number of items: 9.

computer modelling

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Cu columns

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Electronic Packaging

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

flip chip packaging

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Multi-physics modeling

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

Numerical Optimilation

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

Reliability

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

Response Surface

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

Thermal Management

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

This list was generated on Sun Dec 22 14:21:39 2024 UTC.