Items where Author is "Lee, Yung-Cheng"
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Conference Proceedings
Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Boettinger, W.
(1999)
Modelling the fillet lifting defect.
In: Advances in electronic packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99.
American Society of Mechanical Engineers, New Yor, NY, USA, pp. 405-413.
ISBN 9780791816127