Conference Proceedings

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

Lee, Yek Bing, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve and Bartholomew, Martin (2005) Modelling the Lamination Process for Ruggedised Displays. In: International Symposium on Electronic Materials and Packaging 2005 (EMAP 2005). IEEE, pp. 243-246. ISBN 1424401070 (doi:10.1109/EMAP.2005.1598269)

Conference or Conference Paper

Lee, Yek Bing, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.