Book Section

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Lee, Y. C., Wong, C. P. and Suhir, Ephraim, (eds.) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:10.1007/0-387-32989-7_34)

Conference Proceedings

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Norman, P. and Gebreamlak, S. (1997) Computational modelling of defects in fibre optic cables. In: Proceedings of the pacific RIM/ASME international intersociety electronic & photonic packaging conference Interpack '97. The American Society of Mechanical Engineers, New York, NY, US, pp. 621-627. ISBN 0 7918 1559 5