backlights

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

LCD

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

LED

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

light emitting diodes (LEDs)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

luminance

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

optical and thermal modelling techniques

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

ruggedized electronic display

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

thermal management

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)