Skip navigation

Items where Author is "Lee, T.K."

Items where Author is "Lee, T.K."

[up] Up a level
Group by: Item Type | Uncontrolled Keywords | No Grouping
ball grid array (BGA) ball shear test bond strength Finite Element Analysis(FEA) fracture propogation path interfacial reaction phenomena intermetallic compound (IMC) solder interface strength
Number of items: 8.

ball grid array (BGA)

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

ball shear test

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

bond strength

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Finite Element Analysis(FEA)

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

fracture propogation path

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

interfacial reaction phenomena

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

intermetallic compound (IMC)

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

solder interface strength

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

This list was generated on Thu Apr 3 12:41:32 2025 UTC.