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Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:10.1007/s12540-013-5025-z)

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Lu, Emily, Perez, Gabriel, Baker, Peter, Irving, Daniel, Kumar, Santosh, Celorrio, Veronica, Britto, Sylvia, Headen, Thomas F., Gomez-Gonzalez, Miguel, Wright, Connor, Green, Calum, Young, Robert Scott, Kirichek, Oleg, Mortazavi, Ali, Day, Sarah, Antony, Isabel, Wright, Zoe, Wood, Thomas, Snow, Tim, Thiyagalingam, Jeyan, Quinn, Paul, Jones, Martin Owen, David, William and Le Houx, James ORCID: https://orcid.org/0000-0002-1576-0673 (2026) Autonomous battery research: principles of heuristic operando experimentation. [Working Paper] (doi:10.48550/arxiv.2601.00851)