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Items where Author is "Kromann, Gary B."

Items where Author is "Kromann, Gary B."

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Group by: Item Type | Uncontrolled Keywords | No Grouping
circuit reliability Coffin-Manson curing electromagnetic compatibility fatigue flip-chip flipchip life cycle costing modeling modelling printed circuit design quality control reflow reliability underfill
Number of items: 15.

circuit reliability

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

Coffin-Manson

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

curing

Wheeler, D. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

electromagnetic compatibility

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

fatigue

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

flip-chip

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

flipchip

Wheeler, D. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

life cycle costing

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

modeling

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

modelling

Wheeler, D. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

printed circuit design

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

quality control

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

reflow

Wheeler, D. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

reliability

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

underfill

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

This list was generated on Sun Dec 22 14:44:22 2024 UTC.