Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441543)