Items where Author is "Kay, Robert"
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Stoyanov, Stoyan 
ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy
(2004)
Assembly and reliability of isotropic conductive adhesives
for fine pitch flip-chip applications.
In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA.
(Unpublished)
flip-chip assembly
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy
(2004)
Assembly and reliability of isotropic conductive adhesives
for fine pitch flip-chip applications.
In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA.
(Unpublished)
isotropic conductive adhesives
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy
(2004)
Assembly and reliability of isotropic conductive adhesives
for fine pitch flip-chip applications.
In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA.
(Unpublished)
reliability modelling
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy
(2004)
Assembly and reliability of isotropic conductive adhesives
for fine pitch flip-chip applications.
In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA.
(Unpublished)