Skip navigation

Items where Author is "Kay, R."

Items where Author is "Kay, R."

Up a level
Export as [feed] RSS
Group by: Item Type | Uncontrolled Keywords | No Grouping
adhesive bonding adhesives fine-pitch technology flip-chip devices LED displays microassembling organic light emitting diodes semiconductor device packaging semiconductor device reliability surface mount technology thermal management (packaging)
Number of items: 11.

adhesive bonding

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

adhesives

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

fine-pitch technology

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

flip-chip devices

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

LED displays

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

microassembling

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

organic light emitting diodes

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

semiconductor device packaging

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

semiconductor device reliability

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

surface mount technology

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

thermal management (packaging)

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

This list was generated on Mon Nov 25 13:05:39 2024 UTC.