Items where Author is "Kanno, Toshifumi"
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Conference Proceedings
Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Thomas, Owen, Di Maio, Davide and Hunt, Chris
(2010)
An analysis of local deformation of SnAgCu solder joint using digital image correlation.
In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010.
Association for Computing Machinery, New York, pp. 376-381.
ISBN 9781424481408
(doi:https://doi.org/10.1109/ICEPT.2010.5582845)