Items where Author is "Kamara, E."
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96.5Sn3.0Ag0.5Cu lead-free solder
Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2
Ball Grid Arrays (BGAs)
Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2
concave joints
Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2
lead-free solders
Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)
reliability
Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)
solder isothermal fatigue failure
Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2
vibration
Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)