adhesive bonding

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

adhesives

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

CFD

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

computational fluid dynamics

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

cooling

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

design of experiments

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

electronic engineering computing

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

fine-pitch technology

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

finite element analysis

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

finite volume methods

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

flip-chip devices

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

flow simulation

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

forced convection

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

integrated optoelectronics

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

LED displays

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

microassembling

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

natural convection

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

optical backplanes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

optical couplers

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

organic light emitting diodes

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

semiconductor device packaging

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

semiconductor device reliability

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

surface emitting lasers

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

surface mount technology

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

temperature distribution

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

thermal expansion

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

thermal management (packaging)

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

turbulence

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)