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Items where Author is "Islam, M.N."

Items where Author is "Islam, M.N."

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aging contact angle finite element modeling flux growth rate interfacial reactions intermetallic compounds Sn-2.8Ag-0.5Cu-1.0Bi soldering surface tension Wettability wetting force
Number of items: 14.

aging

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

contact angle

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

finite element modeling

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

flux

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

growth rate

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

interfacial reactions

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

Sn-2.8Ag-0.5Cu-1.0Bi

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

soldering

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

surface

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

tension

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

Wettability

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

wetting force

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

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