aging

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

contact angle

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

finite element modeling

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

flux

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

growth rate

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

interfacial reactions

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

Sn-2.8Ag-0.5Cu-1.0Bi

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

soldering

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

surface

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

tension

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

Wettability

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

wetting force

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)