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Items where Author is "Islam, M."

Items where Author is "Islam, M."

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aging intermetallic compound layer solder wetting
Number of items: 4.

aging

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

intermetallic compound layer

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

solder

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

wetting

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

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