Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)