(ICA)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

diffraction experiments

Hoo, Nick, Jackson, Gavin, Hendriksen, Mike, Lu, Hua ORCID: 0000-0002-4392-6562 , Durairaj, Rajkumar, Bailey, Chris ORCID: 0000-0002-9438-3879 , Ekere, Ndy and Wright, Jonathon (2004) In-situ synchrotron x-ray diffraction during melting and solidification of a lead-free solder paste. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

flip chip

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

flip-chip assembly

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

isotropic conductive adhesives

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

modelling

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

reflow

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

reliability

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

reliability modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

solder paste

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

underfill

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

x-rays

Hoo, Nick, Jackson, Gavin, Hendriksen, Mike, Lu, Hua ORCID: 0000-0002-4392-6562 , Durairaj, Rajkumar, Bailey, Chris ORCID: 0000-0002-9438-3879 , Ekere, Ndy and Wright, Jonathon (2004) In-situ synchrotron x-ray diffraction during melting and solidification of a lead-free solder paste. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)