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Items where Author is "Hassan, Sheikh"

Items where Author is "Hassan, Sheikh"

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finite element method Finite Element Method (FEM) Model Order Reduction (MOR) parametric model order reduction parametric Model Order Reduction (pMOR) power electronics module Power Electronics Module (PEM) reliability assessment thermal-mechanical analysis
Number of items: 21.

finite element method

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

Finite Element Method (FEM)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

Model Order Reduction (MOR)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

parametric model order reduction

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

parametric Model Order Reduction (pMOR)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

power electronics module

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

Power Electronics Module (PEM)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

reliability assessment

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

thermal-mechanical analysis

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

This list was generated on Sun Dec 22 13:27:52 2024 UTC.