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Items where Author is "Gregson, C."

Items where Author is "Gregson, C."

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aerospace ball grid arrays finite element analysis integrated circuit interconnections integrated circuit reliability life testing solders thermal stress cracking
Number of items: 7.

aerospace

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879 , Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

ball grid arrays

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879 , Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

finite element analysis

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879 , Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

integrated circuit interconnections

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879 , Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

integrated circuit reliability

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879 , Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

life testing

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879 , Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

solders thermal stress cracking

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879 , Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

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