Items where Author is "Gregson, C."

[up]

Group by: Item Type | Uncontrolled Keywords | No Grouping

aerospace ball grid arrays finite element analysis integrated circuit interconnections integrated circuit reliability life testing solders thermal stress cracking

Number of items: 7.

aerospace

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

ball grid arrays

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

finite element analysis

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

integrated circuit interconnections

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

integrated circuit reliability

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

life testing

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

solders thermal stress cracking

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

This list was generated on Sat Dec 21 18:52:38 2024 UTC.