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Items where Author is "Gong, Ke"

Items where Author is "Gong, Ke"

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flip-chip assembly no-flow underfill materials
Number of items: 2.

flip-chip assembly

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

no-flow underfill materials

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

This list was generated on Sun Dec 22 11:57:47 2024 UTC.