Article

Kay, Robert W., Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Glinski, Greg P., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)